DUBLIN, October 20, 2021--(BUSINESS WIRE)--The "Global Fan-out Wafer Level Packaging Market 2021-2025" report has been added to ResearchAndMarkets.com's offering.
The publisher has been monitoring the fan-out wafer level packaging market and it is poised to grow by $1.60 billion during 2021-2025, decelerating at a CAGR of 14.29% during the forecast period.
This report on the fan-out wafer level packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the increased demand for compactly designed electronics and the growing use of semiconductor ICs in IoT.
The fan-out wafer level packaging market analysis includes the technology segment and geographic landscape. This study identifies the rapid adoption of FinFET technology as one of the prime reasons driving the fan-out wafer level packaging market growth during the next few years.
Amkor Technology Inc.
ASE Technology Holding Co. Ltd.
Cypress Semiconductor Corp.
Infineon Technologies AG
JCET Group Co. Ltd.
NXP Semiconductors NV
Renesas Electronics Corp.
Samsung Electronics Co. Ltd.
Siliconware Precision Industries Co. Ltd.
Taiwan Semiconductor Manufacturing Co. Ltd.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. This report on fan-out wafer level packaging market covers the following areas:
Fan-out wafer level packaging market sizing
Fan-out wafer level packaging market forecast
Fan-out wafer level packaging market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The publisher's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Key Topics Covered:
1. Executive Summary
2. Market Landscape
Value chain analysis
3. Market Sizing
Market segment analysis
Market size 2020
Market outlook: Forecast for 2020 - 2025
4. Five Forces Analysis
Bargaining power of buyers
Bargaining power of suppliers
Threat of new entrants
Threat of substitutes
Threat of rivalry
5. Market Segmentation by Technology
Comparison by Technology
High density - Market size and forecast 2020-2025
Standard density - Market size and forecast 2020-2025
Market opportunity by Technology
6. Customer landscape
7. Geographic Landscape
APAC - Market size and forecast 2020-2025
North America - Market size and forecast 2020-2025
Europe - Market size and forecast 2020-2025
South America - Market size and forecast 2020-2025
MEA - Market size and forecast 2020-2025
Key leading countries
Market opportunity By Geographical Landscape
8. Vendor Landscape
9. Vendor Analysis
Market positioning of vendors
For more information about this report visit https://www.researchandmarkets.com/r/t6o7c6
View source version on businesswire.com: https://www.businesswire.com/news/home/20211020005643/en/
Laura Wood, Senior Press Manager
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